Azam, Huzaifa and Singh, Amares and Tan, Wei Hong and Ishak, Muhammad Amir Aziat and Nasiri Tabrizi, Bahman and Viyapuri, Rubentheren and Mhd Noor, Ervina Efzan and Choo, Hui Leng (2026) Thermal, wetting, and microstructural properties of the tin–bismuth (Sn–58Bi) solder joint at different reflow temperatures. Journal of Materials Science: Materials in Electronics, 37 (26). ISSN 0957-4522

Singh, Amares and Mhd Noor, Ervina Efzan and Durairaj, Rajkumar and Lee, Kong Chian (2018) Reliability study of lead free Sn-3.8Ag-0.7Cu and copper (Cu) substrate based on the microstructure, physical and mechanical properties. Journal of Mechanical Engineering and Sciences, 5 (2). pp. 169-180. ISSN 1823- 5514, 2550-164X

Mhd Noor, Ervina Efzan and Singh, Amares (2014) Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys. Soldering & Surface Mount Technology, 26 (3). pp. 147-161. ISSN 0954-0911

Mhd Noor, Ervina Efzan and Singh, Amares and Yap, Tze Chuan (2013) A review: Influence of nano particles reinforced on solder alloy. Soldering & Surface Mount Technology, 25 (4). pp. 229-241. ISSN 0954-0911