Singh, Amares and Mhd Noor, Ervina Efzan and Durairaj, Rajkumar and Lee, Kong Chian (2018) Reliability study of lead free Sn-3.8Ag-0.7Cu and copper (Cu) substrate based on the microstructure, physical and mechanical properties. Journal of Mechanical Engineering and Sciences, 5 (2). pp. 169-180. ISSN 1823- 5514, 2550-164X

Mhd Noor, Ervina Efzan and Singh, Amares (2014) Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys. Soldering & Surface Mount Technology, 26 (3). pp. 147-161. ISSN 0954-0911

Mhd Noor, Ervina Efzan and Singh, Amares and Yap, Tze Chuan (2013) A review: Influence of nano particles reinforced on solder alloy. Soldering & Surface Mount Technology, 25 (4). pp. 229-241. ISSN 0954-0911