Citation

Azam, Huzaifa and Singh, Amares and Tan, Wei Hong and Ishak, Muhammad Amir Aziat and Nasiri Tabrizi, Bahman and Viyapuri, Rubentheren and Mhd Noor, Ervina Efzan and Choo, Hui Leng (2026) Thermal, wetting, and microstructural properties of the tin–bismuth (Sn–58Bi) solder joint at different reflow temperatures. Journal of Materials Science: Materials in Electronics, 37 (26). ISSN 0957-4522

Text s10854-026-18461-9.pdf - Published Version Restricted to Repository staff only Download (4MB)

Abstract

The thermal, wetting, and microstructural properties of tin–bismuth (Sn–58Bi) solder joints were investigated at three reflow temperatures of 160, 170, and 180°C to assess their performance for low-temperature assembly processes. Differential scanning calorimetry (DSC) analysis revealed that the Sn–58Bi alloy exhibited a melting range between 139 and 145°C, confirming its low-temperature applicability for reduced thermal processing conditions. Contact angles were measured at 78.4, 68.95, and 69.39° at 160, 170, and 180°C, respectively, classifying the SnBi as having moderate wettability behavior. The spreading ratios of 347.7, 333.7, and 322.80 for 160, 170, and 180°C were measured demonstrating an inverse relationship with contact angle. The microstructural observations from scanning electron microscopy (SEM) at the SnBi/Cu solder joint interface revealed the formation of a relatively uniform Cu6Sn5 intermetallic compound (IMC) layer at 170 and 180°C, whereas minimal or no IMC formation was observed at 160°C due to insufficient interfacial reactions. The findings indicate that Sn–58Bi solder joint at the lower reflow temperature of 160, 170, and 180°C showed acceptable wettability condition (contact angle < 90°) and interfacial characteristics (thin IMC layer, < 2μm), supporting its potential application for energy-efficient and thermally sensitive microelectronic assembly processes.

Item Type:	Article
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK4601-4661 Electric heating
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Suzilawati Abu Samah
Date Deposited:	01 Oct 2026 02:33
Last Modified:	01 Oct 2026 02:33
URII:	http://shdl.mmu.edu.my/id/eprint/16755

Downloads

Edit (login required)