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Conference or Workshop Item

Kok, Chee Kuang and Tay, Hui Ling and Lim, Boon Kian and Liew, Kia Wai and Samylingam, Lingenthiran and Ooi, Chin Chin (2024) Modeling the Dynamic Responses of Industrial Printed Circuit Board. In: 2024 Multimedia University Engineering Conference (MECON), 23-25 July 2024, Cyberjaya, Malaysia.