Items where Author is "Azam, Huzaifa"
 | Up a level |
Group by: Item Type | No Grouping
Number of items: 1.
Azam, Huzaifa and Singh, Amares and Tan, Wei Hong and Ishak, Muhammad Amir Aziat and Nasiri Tabrizi, Bahman and Viyapuri, Rubentheren and Mhd Noor, Ervina Efzan and Choo, Hui Leng (2026) Thermal, wetting, and microstructural properties of the tin–bismuth (Sn–58Bi) solder joint at different reflow temperatures. Journal of Materials Science: Materials in Electronics, 37 (26). ISSN 0957-4522