Citation

Mohd. Noor, Ervina Efzan and Mhd Nasir, Nur Faziera (2020) Review on the effect of Gallium in solder alloy. IOP Conference Series: Materials Science and Engineering, 957 (1). ISSN 1757-8981

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Abstract

Soldering is a well-known metallurgical joining method that uses a filler metal, the solder, with a melting point below 425°C. The trends toward to miniaturization in microelectronic packaging industries have motivated the development of high performance lead-free solders. However, the properties of the lead free solder cannot match the properties of lead solder. To overcome this problem, a dopant is added to the based lead free solder. In this paper, review on the effect of Gallium as doped was discussed.

Item Type:	Article
Uncontrolled Keywords:	Gallium
Subjects:	T Technology > TP Chemical technology > TP200-248 Chemicals: Manufacture, use, etc.
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Suzilawati Abu Samah
Date Deposited:	03 Nov 2021 01:47
Last Modified:	03 Nov 2021 01:47
URII:	http://shdl.mmu.edu.my/id/eprint/8411

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