Citation
Mohd. Noor, Ervina Efzan and Mhd Nasir, Nur Faziera (2020) Review on the effect of Gallium in solder alloy. IOP Conference Series: Materials Science and Engineering, 957 (1). ISSN 1757-8981
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Official URL: https://iopscience.iop.org/article/10.1088/1757-89...
Abstract
Soldering is a well-known metallurgical joining method that uses a filler metal, the solder, with a melting point below 425°C. The trends toward to miniaturization in microelectronic packaging industries have motivated the development of high performance lead-free solders. However, the properties of the lead free solder cannot match the properties of lead solder. To overcome this problem, a dopant is added to the based lead free solder. In this paper, review on the effect of Gallium as doped was discussed.
Item Type: | Article |
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Uncontrolled Keywords: | Gallium |
Subjects: | T Technology > TP Chemical technology > TP200-248 Chemicals: Manufacture, use, etc. |
Divisions: | Faculty of Engineering and Technology (FET) |
Depositing User: | Ms Suzilawati Abu Samah |
Date Deposited: | 03 Nov 2021 01:47 |
Last Modified: | 03 Nov 2021 01:47 |
URII: | http://shdl.mmu.edu.my/id/eprint/8411 |
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