Citation

Abdalla, Hana and Mhd Noor, Ervina Efzan and You, Ah Heng (2021) Development and Characterization of a Hybrid Solder Alloy on a Copper Substrate. In: 2nd FET PG Engineering Colloquium Proceedings 2021, 1-15 Dec. 2021, Online Conference. (Unpublished)

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Abstract

The study of the composite solders alloy can be divided into few major sections, which are the metallurgical study, the physical properties such as density and wetting angle, thermal properties, and finally the mechanical properties.

Item Type:	Conference or Workshop Item (Paper)
Uncontrolled Keywords:	Mechanical properties, Lead-free, Solder alloy, Composite alloy, Wetting angle, Microstructure, Thermal analysis
Subjects:	T Technology > TA Engineering (General). Civil engineering (General) > TA401-492 Materials of engineering and construction. Mechanics of materials
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Nurul Iqtiani Ahmad
Date Deposited:	28 Jan 2022 01:04
Last Modified:	28 Jan 2022 01:04
URII:	http://shdl.mmu.edu.my/id/eprint/9908

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