Citation
Leong, Kum Foo (2003) Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints. Masters thesis, Multimedia University. Full text not available from this repository.
Official URL: http://myto.perpun.net.my/metoalogin/logina.php
Abstract
The densification of the input/output in integrated circuits necessitates a transition from the through-hole assembly to the surface mount technology. The wave soldering process for the through-hole assembly is incorporated to form a mixed-soldering process for SMT to ensure mechanical strength in some of the peripherals. In this project, the effect of repeated wave-soldering heating on the SMT mounted Sn/Pb eutectic solder joint on HASL (Hot Air Solder Leveling) PCB is investigated by measuring its three point bend strength.
| Item Type: | Thesis (Masters) |
|---|---|
| Subjects: | Q Science > QA Mathematics |
| Divisions: | Faculty of Engineering (FOE) |
| Depositing User: | Ms Rosnani Abd Wahab |
| Date Deposited: | 15 Jul 2010 06:31 |
| Last Modified: | 15 Jul 2010 06:31 |
| URII: | http://shdl.mmu.edu.my/id/eprint/971 |
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