Citation
Chung, Chee Key (2003) Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering. Masters thesis, Multimedia University. Full text not available from this repository.
Official URL: http://myto.perpun.net.my/metoalogin/logina.php
Abstract
In this project, the effects of oxygen concentration on solder joint during reflow soldering are studied. Parameters studied include solder wetting angle, oxidation, microstructures and solder joint strength.
| Item Type: | Thesis (Masters) |
|---|---|
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics |
| Divisions: | Faculty of Engineering (FOE) |
| Depositing User: | Ms Rosnani Abd Wahab |
| Date Deposited: | 14 Jul 2010 02:29 |
| Last Modified: | 14 Jul 2010 02:29 |
| URII: | http://shdl.mmu.edu.my/id/eprint/961 |
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