Citation
Mhd Noor, Ervina Efzan and M. M., Nur Haslinda and Abdullah, M. M. Al Bakri (2021) A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy. In: AIP Conference Proceedings. Full text not available from this repository.
Official URL: https://doi.org/10.1063/5.0052172
Abstract
Sn-Ag-Cu lead-free solder alloy containing nanoparticles has been extensively developed as replacement for the conventional tin-lead (Sn-Pb) solder in electronic packaging industry. Sn-Ag-Cu solder alloy has been receiving a lot of attention with its good reliability and mechanical properties. Addition of nanoparticles in Sn-Ag-Cu solder with appropriate content provides remarkable improvements on the properties of Sn-Ag-Cu solder. Thus, this paper reviews the effects of addition of nanoparticles on the properties of Sn-Ag-Cu lead free solder alloy.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Uncontrolled Keywords: | Nanoparticles |
| Subjects: | R Medicine > RS Pharmacy and materia medica |
| Divisions: | Faculty of Engineering and Technology (FET) |
| Depositing User: | Ms Nurul Iqtiani Ahmad |
| Date Deposited: | 30 Aug 2021 07:22 |
| Last Modified: | 30 Aug 2021 07:22 |
| URII: | http://shdl.mmu.edu.my/id/eprint/9466 |
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