Citation

Mhd Noor, Ervina Efzan and M. M., Nur Haslinda and Abdullah, M. M. Al Bakri (2021) A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy. In: AIP Conference Proceedings.

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Abstract

Sn-Ag-Cu lead-free solder alloy containing nanoparticles has been extensively developed as replacement for the conventional tin-lead (Sn-Pb) solder in electronic packaging industry. Sn-Ag-Cu solder alloy has been receiving a lot of attention with its good reliability and mechanical properties. Addition of nanoparticles in Sn-Ag-Cu solder with appropriate content provides remarkable improvements on the properties of Sn-Ag-Cu solder. Thus, this paper reviews the effects of addition of nanoparticles on the properties of Sn-Ag-Cu lead free solder alloy.

Item Type:	Conference or Workshop Item (Paper)
Uncontrolled Keywords:	Nanoparticles
Subjects:	R Medicine > RS Pharmacy and materia medica
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Nurul Iqtiani Ahmad
Date Deposited:	30 Aug 2021 07:22
Last Modified:	30 Aug 2021 07:22
URII:	http://shdl.mmu.edu.my/id/eprint/9466

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