Citation

Khai, Shiang Tan and Sim, Jui Onn and Chun, Sean Lau and Yoong, Tatt Chin and Chen, Hon Nee and Teck, Yong Tou and Seong, Shan Yap (2019) Study of the effects of carbon-based particle additives in SAC305 solders. In: The 27th Annual International Conference of Composite/Nanoengineering (ICCE27), 14-20 July 2019, University of Granada, Granada, Spain.

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Abstract

The demand for lightweight and high functionality devices have been a driving force in the development of smaller, lighter and compact electronics circuit. While printed circuit board (PCB) can provides interconnection and allow components to be assembled on, solder paste is needed to connect the two surfaces together by going through reflow during surface mount technology (SMT) process. The solder joints provide not only electrical integrity, but also mechanical support to hold the components in place. Due to environmental concern, lead-containing solder where the Sn content is 5-70%, has been replaced with lead-free solder where the Sn content is ~95%. Lead-free solder has higher melting temperature and thus higher processing temperature. The peak reflow temperature of the lead free solder SnAgCu (96Sn-3Ag-0.5Cu) alloy, SAC305 is typically 25 C higher than the melting temperature of 217 C [1

Item Type:	Conference or Workshop Item (Paper)
Uncontrolled Keywords:	Crystallographic
Subjects:	T Technology > TD Environmental technology. Sanitary engineering
Divisions:	Faculty of Engineering (FOE)
Depositing User:	Ms Rosnani Abd Wahab
Date Deposited:	08 Nov 2021 12:27
Last Modified:	08 Nov 2021 12:27
URII:	http://shdl.mmu.edu.my/id/eprint/9299

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