Citation

Mhd Noor, Ervina Efzan and Baaljinder, R. and Emerson Raja, Joseph (2018) A study on the effect of electromigration on solder alloy joint on copper with nickel surface finish. Soldering & Surface Mount Technology, 30 (1). pp. 26-34. ISSN 0954-0911

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Abstract

The purpose of this study is to investigate the effect of electromigration (EM) on solder alloy joint on copper with nickel surface finish. Sn-Bi solder alloy has been used in this research. The EM process was completed with the duration of 0, 24, 48, 72 and 96 h under direct current (DC) of 1,000 mA. Tensile stress on the substrates was assessed after EM at a tension rate of 0.1 mm/min. Microscopy was used to observe the formation and size of voids and conduct an analysis between copper and nickel substrates. Findings – Four types of intermetallic compounds (IMCs), namely, Cu-Sn, Cu3Sn, Cu6Sn5, and Sn-Bi, were detected between the Sn-Bi/Co solder joint. Voids appear to be at the anode and the cathode for 96 h of EM for Sn-Bi/Ni solder join; however, there seem to be more voids at the cathode. Originality/value – EM is one of the crucial keys to produce a good integrated circuit (IC). When the current density is extremely high and will cause the metal ions to move into the electron direction flow, it will be characterised based on the ion flux density. In this research, the effect of EM on the Sn-Bi solder alloy joint on copper with nickel surface finish was studied.

Item Type:	Article
Uncontrolled Keywords:	Solder and soldering, hardness, tensile, tensile testing, electromigration, substrate
Subjects:	T Technology > TT Handicrafts Arts and crafts > TT205-267 Metalworking
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Rosnani Abd Wahab
Date Deposited:	22 Oct 2020 23:04
Last Modified:	22 Oct 2020 23:04
URII:	http://shdl.mmu.edu.my/id/eprint/7223

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