Citation

Mhd Noor, Ervina Efzan and Ogundipe, Ayodeji Samson (2017) Effect of fluxes on Sn-Zn-Bi solder alloys on copper substrate. Soldering & Surface Mount Technology, 29 (4). pp. 225-234. ISSN 0954-0911

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Abstract

This paper aims to investigate the effect different fluxes have on the mechanical properties of lead-free solders, specifically Sn-Zn-Bi solder alloy. The solder billets were soldered in between copper substrates and flux was applied. The mechanical tests carried out on the solder alloys were tensile and shear tests. They were experimented on with different fluxes, namely, water-soluble (paste), rosin mildly activated (RMA) and insoluble (RMA) flux. From these experiments, the ultimate tensile strength, shear strength, elongation, yield stress, Young’s modulus and the stress-strain curve are derived. The results showed that solder billets that were soldered onto copper substrates with water-soluble flux yielded the highest ultimate tensile strength and shear strength values of 9.9961 MPa and 118.836 MPa, respectively. Billets soldered using RMA flux had the highest values of elongation and Young’s modulus, 0.306 mm and 50,257.295 MPa, respectively. However, on viewing the failure of all the specimens under an optical microscope and scanning electron microscope (SEM), specimens soldered using water-soluble flux possessed the least deformities, depicting their higher level of mechanical properties, entailing their strength and ductility, deeming them as the most suitable flux for microelectronic applications.

Item Type:	Article
Uncontrolled Keywords:	Solder and soldering, Shear strength, Flux, Solder, Lead-free
Subjects:	T Technology > TS Manufactures > TS200-770 Metal manufactures. Metalworking
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Rosnani Abd Wahab
Date Deposited:	26 Oct 2020 21:18
Last Modified:	26 Oct 2020 21:29
URII:	http://shdl.mmu.edu.my/id/eprint/7087

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