Citation

Segar Singh, Amares Singh Gill (2015) Influence of Alumina and Titanium Dioxide Nanoparticles Reinforcement on Sn-3.0ag-0.5cu and Sn-58bi Solder Alloys. Masters thesis, Multimedia University.

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Abstract

This research investigates the influence of aluminium oxide (Al2O3) and titanium dioxide (TiO2) nanoparticles added to Sn-3.0Ag-0.5Cu and Sn-58Bi solders and compared to the bare Sn-3.0Ag-0.5Cu and Sn-58Bi solders which are novel studies in this field especially for the study of the Sn-58Bi added with nanoparticles. The lowest melting temperature was noted for the Sn-3.0Ag-0.5Cu added with 3% Al2O3 and TiO2 nanoparticles with 220.64°C and 220.30°C, while for Sn-58Bi reinforcement, the lowest temperature was for the 1% Al2O3 and TiO2 addition of 144.25°C and 142.80°C, yet both reinforced solder alloy had melting temperatures slightly 1°C higher than the bare solders. Microstructures of Sn-3.0Ag-0.5Cu reinforced solder alloy refined as additions were made with smaller Sinn-matrix and wider eutectic phase comprising Ag3Sn and Cu6Sn5 intermetallic compounds (IMC). As for the Sn-58Bi solder alloy, the microstructure consists of lamellar structure with Bi precipitations and eutectic phases. All the important physical, metallurgical and mechanical properties were studied to achieve the objectives.

Item Type:	Thesis (Masters)
Additional Information:	Call No.: TA418.78 .S56 2015
Uncontrolled Keywords:	Nanoparticles
Subjects:	T Technology > TA Engineering (General). Civil engineering (General) > TA401-492 Materials of engineering and construction. Mechanics of materials
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Nurul Iqtiani Ahmad
Date Deposited:	06 Sep 2017 15:45
Last Modified:	06 Sep 2017 15:45
URII:	http://shdl.mmu.edu.my/id/eprint/6881

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