Citation
Mhd Noor, Ervina Efzan and Mhd Nasir, Nur Faziera and Idris, Siti Rabiatul Aisya (2016) A review: lead free solder and its wettability properties. Soldering & Surface Mount Technology, 28 (3). pp. 125-132. ISSN 0954-0911 Full text not available from this repository.
Official URL: http://doi.org/10.1108/SSMT-08-2015-0022
Abstract
The purpose of this paper is to publish on the review of the lead free solder for electronic packaging. This involved the basic principles of the solder, the lead solder and its legislation and the lead free solder with its mechanism. In addition, this paper also reviews on the lead free solder characteristics that focused on its wettability.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | Alloys, Wetting, Solder, Solder alloys |
| Subjects: | T Technology > TA Engineering (General). Civil engineering (General) > TA401-492 Materials of engineering and construction. Mechanics of materials |
| Divisions: | Faculty of Engineering and Technology (FET) |
| Depositing User: | Ms Rosnani Abd Wahab |
| Date Deposited: | 16 Jul 2020 01:39 |
| Last Modified: | 16 Jul 2020 01:39 |
| URII: | http://shdl.mmu.edu.my/id/eprint/6791 |
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