Citation

Mhd Noor, Ervina Efzan and Zuhailawati, H. and Radzali, Othman (2016) Low temperature In–Bi–Zn solder alloy on copper substrate. Journal of Materials Science: Materials in Electronics, 27 (2). pp. 1408-1415. ISSN 0957-4522; eISSN: 1573-482X

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Abstract

In this paper, characteristic of In–32.7Bi–0.5Zn lead-free solder system have been studied. DSC shows that, In–32.7Bi–0.5Zn system alloy give low melting temperature at 72.30 °C. Lowest melting temperature ensures that the solder melts, forms a joint with the substrates, and re-solidifies within the shortest possible process time. Further, the wettability between molten solder and copper substrate was measured at different reflow temperature. The contact angle for In–32.7Bi–0.5Zn solder alloys were decreasing 30.76° to 24.5° as the temperature increased from 100 to 140 °C. A significant increment of contact angle for In–32.7Bi–0.5Zn at 140 °C. The result of spreading area is inversed with the contact angle. Energy-dispersive X-ray analysis indicated two layer of intermetallic compound between the solder and the substrate; Cu5Zn8 and Cu11In9 compound.

Item Type:	Article
Subjects:	T Technology > TA Engineering (General). Civil engineering (General) > TA401-492 Materials of engineering and construction. Mechanics of materials
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Rosnani Abd Wahab
Date Deposited:	13 Dec 2017 16:12
Last Modified:	13 Dec 2017 16:12
URII:	http://shdl.mmu.edu.my/id/eprint/6629

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