Citation
Chin, Y.T. (2010) Materials Science; Researchers at Multimedia University target materials science. Technology News Focus. p. 2245. Full text not available from this repository.
Official URL: http://search.proquest.com/docview/733900153?accou...
Abstract
2010 AUG 4 - (VerticalNews.com) -- Electroless nickel (Ni-P) is a common surface finish used in the ball grid array (BGA) package and interfacial reactions between its surface finish and lead-free solders can form complex intermetallic compound (IMC) layers.
| Item Type: | Article |
|---|---|
| Subjects: | Q Science > Q Science (General) |
| Divisions: | Faculty of Engineering (FOE) |
| Depositing User: | Ms Suzilawati Abu Samah |
| Date Deposited: | 10 Sep 2013 08:20 |
| Last Modified: | 10 Sep 2013 08:20 |
| URII: | http://shdl.mmu.edu.my/id/eprint/3991 |
Downloads
Downloads per month over past year
 Edit (login required) |