Study Of MSQ As Low-K Dielectric Material For Semiconductor Devices

Citation

Wong, Man On (2006) Study Of MSQ As Low-K Dielectric Material For Semiconductor Devices. Masters thesis, Multimedia University.

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Abstract

High spped performance in VLSI devices requires the use of semiconductor materials such as copper interconnects and low-k dielectric. Low-k dielectric can reduce the parasitic capacitance between two metal lines, which allows higher operational speed as compared to silicon oxide.

Item Type: Thesis (Masters)
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
Divisions: Faculty of Engineering (FOE)
Depositing User: Ms Rosnani Abd Wahab
Date Deposited: 23 Aug 2010 03:47
Last Modified: 23 Aug 2010 03:47
URII: http://shdl.mmu.edu.my/id/eprint/1124

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