Citation

Mohamed Muzni, Nur Haslinda and Mhd Noor, Ervina Efzan and Abdullah, Mohd Mustafa Al Bakri (2021) Intermetallic compound growth mechanism of hybrid nanocomposite lead-free solder. In: 2nd FET PG Engineering Colloquium Proceedings 2021, 1-15 Dec. 2021, Online Conference. (Unpublished)

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Abstract

The lead-free SAC nanocomposite solder alloy was prepared by mechanically dispersing 0.25, 0.50, 0.75, and 1.0 wt% of TiO2 and Al2O3 nanoparticles into the lead-free SAC solder alloy. Differential scanning calorimetry (DSC) was used to investigate the melting temperatures of the lead-free SAC nanocomposite solders. Specimens were heated at a rate of 10°C/min in an Argon environment, with a temperature range of 30-300 °C. The spread area and contact angle were used to determine the solder wettability.

Item Type:	Conference or Workshop Item (Paper)
Uncontrolled Keywords:	Intermetallic compound, Nanoparticle, Lead-free, Nanocomposites (Materials)
Subjects:	T Technology > TA Engineering (General). Civil engineering (General) > TA401-492 Materials of engineering and construction. Mechanics of materials
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Nurul Iqtiani Ahmad
Date Deposited:	25 Jan 2022 14:20
Last Modified:	25 Jan 2022 14:30
URII:	http://shdl.mmu.edu.my/id/eprint/9882

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