Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints

Leong, Kum Foo (2003) Ternary Intermetallic Formation And Mechanical Strength Of Wave Soldered BGA Joints. Masters thesis, Multimedia University.

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Abstract

The densification of the input/output in integrated circuits necessitates a transition from the through-hole assembly to the surface mount technology. The wave soldering process for the through-hole assembly is incorporated to form a mixed-soldering process for SMT to ensure mechanical strength in some of the peripherals. In this project, the effect of repeated wave-soldering heating on the SMT mounted Sn/Pb eutectic solder joint on HASL (Hot Air Solder Leveling) PCB is investigated by measuring its three point bend strength.

Item Type: Thesis (Masters)
Subjects: Q Science > QA Mathematics
Divisions: Faculty of Engineering (FOE)
Depositing User: Ms Rosnani Abd Wahab
Date Deposited: 15 Jul 2010 06:31
Last Modified: 15 Jul 2010 06:31
URI: http://shdl.mmu.edu.my/id/eprint/971

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