Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering

Chung, Chee Key (2003) Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering. Masters thesis, Multimedia University.

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Abstract

In this project, the effects of oxygen concentration on solder joint during reflow soldering are studied. Parameters studied include solder wetting angle, oxidation, microstructures and solder joint strength.

Item Type: Thesis (Masters)
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
Divisions: Faculty of Engineering (FOE)
Depositing User: Ms Rosnani Abd Wahab
Date Deposited: 14 Jul 2010 02:29
Last Modified: 14 Jul 2010 02:29
URI: http://shdl.mmu.edu.my/id/eprint/961

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