Materials Science; Researchers at Multimedia University target materials science

Chin, Y.T. (2010) Materials Science; Researchers at Multimedia University target materials science. Technology News Focus. p. 2245.

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Abstract

2010 AUG 4 - (VerticalNews.com) -- Electroless nickel (Ni-P) is a common surface finish used in the ball grid array (BGA) package and interfacial reactions between its surface finish and lead-free solders can form complex intermetallic compound (IMC) layers.

Item Type: Article
Subjects: Q Science > Q Science (General)
Divisions: Faculty of Engineering (FOE)
Depositing User: Ms Suzilawati Abu Samah
Date Deposited: 10 Sep 2013 08:20
Last Modified: 10 Sep 2013 08:20
URI: http://shdl.mmu.edu.my/id/eprint/3991

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