Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field

R., Balachandran and H. K., Yow and B. H., Ong and R. M., Manickam and K., Anuar and W. T, Teoh and K. B., Tan (2008) Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field. In: IEEE International Conference on Semiconductor Electronics, 25-27 Nov 2008, Johor Bahru, MALAYSIA .

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Abstract

Nickel-Iron (Ni-Fe) thin films were pulse-electrodeposited on copper (Cu) substrates under galvanostatic mode in the presence/absence of an ultrasonic field. The as-prepared thin films were characterized by X-Ray Diffractometer (XRD) and Scanning Electron Microscopy (SEM). The XRD results confirmed the deposition of NiFe on Cu substrates and the crystallite size calculated from Scherrer's formula is 22.28 nm and 20.17 nm respectively for the films fabricated in the absence and presence of ultrasonic field. The grain sizes, from SEM micrographs, were found to be 225.52 nm and 79.64 nm respectively for the films fabricated in the absence and presence of ultrasonic field and the grains were in the shape of spherical balls.

Item Type: Conference or Workshop Item (Paper)
Subjects: T Technology > T Technology (General)
Q Science > QA Mathematics > QA75.5-76.95 Electronic computers. Computer science
Divisions: Faculty of Engineering and Technology (FET)
Depositing User: Ms Suzilawati Abu Samah
Date Deposited: 19 Sep 2011 07:53
Last Modified: 19 Sep 2011 07:53
URI: http://shdl.mmu.edu.my/id/eprint/2829

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