Citation

Mohamed Muzni, Nur Haslinda and Mhd Noor, Ervina Efzan and Abdullah, Mohd Mustafa Al Bakri (2023) Influence of TiO2 and Al2O3 Nanoparticles Addition on the IMC Growth of Sn-3.0Ag-0.5Cu Lead-Free Solder at Different Reflow TIME. In: 2nd FET PG Engineering Colloquium Proceedings 2023, 1-31 December 2023, Multimedia University, Malaysia. (Submitted)

Text (Poster) 15. PPM Poster - Nur Haslinda - Ervina Efzan Binti Mhd Noor.pdf - Submitted Version Restricted to Registered users only Download (513kB)

Abstract

This study investigated the influence of reinforcing 0.50 wt.% of titanium oxide (TiO2) and aluminum oxide (Al2O3) nanoparticles on the wettability performance of a Sn3.0Ag-0.5Cu (SAC305) solder alloy. The thermal properties of the SAC305 nanocomposite solder are comparable with those of an SAC305 solder with a peak temperature window within a range of 240 to 250°C. The wetting behavior of the nonreinforced and reinforced SAC305 nanocomposite solder was determined and measured using the contact angle and spreading area and the relationships between them were studied. There is an increment in the spreading area (5.6 to 7.32 mm) by 30.71% and a reduction in the contact angle (26.3 to 18.6°) by 14.29% with an increasing reflow time up to 60s when reinforcing SAC305 solder with 0.50 wt.% of TiO2 and Al2O3 nanoparticles. The SAC305 nanocomposite solder has a better wetting performance compared with the SAC305 solder. As the reflow time increased, the spreading area increased and the contact angle decreased, which restricted intermetallic compound growth and thus improved wettability performance.

Item Type:	Conference or Workshop Item (Poster)
Subjects:	Q Science > QD Chemistry > QD450-801 Physical and theoretical chemistry
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Suzilawati Abu Samah
Date Deposited:	03 Apr 2024 01:36
Last Modified:	03 Apr 2024 01:36
URII:	http://shdl.mmu.edu.my/id/eprint/12344

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