Items where Author is "Tan, Y. Y"
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Tan, Y. Y and Sim, Kok Swee (2014) Effect of Cu and PdCu wire bonding on bond pad splash. Electronics Letters, 50 (15). pp. 1095-1096. ISSN 1350-911X
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Tan, Y. Y and Sim, Kok Swee (2014) Effect of Cu and PdCu wire bonding on bond pad splash. Electronics Letters, 50 (15). pp. 1095-1096. ISSN 1350-911X