Items where Author is "Seetharamu, , K. N."

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Sujan, ., D and Sridhar, , T. S. and Seetharamu, , K. N. and Murthy,, M. V. V. and Hassan,, A. Y. (2006) An accurate solution for thermo-mechanical stresses in tri-material assembly in electronic packages. 2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 1-3. pp. 259-266.

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