Items where Author is "Ng, Wen Jie"
 | Up a level |
Group by: Item Type | No Grouping
Number of items: 1.
Kok, Chee Kuang and Ng, Wen Jie and Ooi, Chin Chin and Liew, Kia Wai (2016) Ball-grid-array solder joint model for assembly-level impact reliability prediction. Microelectronics Reliability, 65. pp. 184-191. ISSN 0026-2714