Main Menu

    Items where Author is "Loon, Kuan Teng"

    Up a level
    Export as [feed] Atom [feed] RSS 1.0 [feed] RSS 2.0
    Group by: Item Type | No Grouping
    Jump to: Article | Conference or Workshop Item | Thesis
    Number of items: 3.

    Article

    Kok, Chee Kuang and Mhd Noor, Ervina Efzan and Ooi, Chin Chin and Loon, Kuan Teng (2018) Micromechanics Models of Industrial Printed Circuit Boards for Bending Analysis. Advanced Science Letters, 24 (11). 8826-8830(5). ISSN 1936-6612, 1936-7317

    Conference or Workshop Item

    Kok, Chee Kuang and Loon, Kuan Teng and Mohd. Noor, Ervina Efzan and Ooi, Chin Chin (2018) Modeling the Elastic Behavior of an Industrial Printed Circuit Board Under Bending and Shear. In: IEEE Transactions on Components, Packaging and Manufacturing Technology, 21 November 2018, Ministry of Higher Education.

    Thesis

    Loon, Kuan Teng (2019) Predicting The Elastic Behaviour Of Multilayer High Density Interconnect Printed Circuit Board From Its Constituent Materials. Masters thesis, Multimedia University.

    This list was generated on Sun Dec 22 14:03:32 2024 +08.

    MMU Institutional Repository is powered by EPrints | Siti Hasmah Digital Library | Multimedia University