Items where Author is "LAM, P"
 | Up a level |
Group by: Item Type | No Grouping
Jump to: Article
Number of items: 1.
Article
CHIN, Y and LAM, P and YOW, H and TOU, T (2008) Investigation of mechanical shock testing of lead-free SAC solder joints in fine pitch BGA package. Microelectronics Reliability, 48 (7). pp. 1079-1086. ISSN 00262714