Items where Author is "Chin, Yoong Tatt"
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Article
Onn, Sim Jui and Tan, Khai Shiang and Tou, Teck Yong and Yap, Seong Shan and Lau, Chun Sean and Chin, Yoong Tatt (2021) Effect of heating profile on printed circuit boards using Shadow Moiré and simulations. AIP Conference Proceedings, 2319 (1). ISSN 1551-7616
Leong, Chern Yang and Yap, Seong Shan and Ong, Guang Liang and Ong, Teng Sian and Yap, Seong Ling and Chin, Yoong Tatt and Lee, Siaw Foon and Tou, Teck Yong and Nee, Chen Hon (2020) Single pulse laser removal of indium tin oxide film on glass and polyethylene terephthalate by nanosecond and femtosecond laser. Nanotechnology Reviews, 9 (1). pp. 1539-1549. ISSN 2191-9097
Tan, Khai Shiang and Onn, Sim Jui and Tou, Teck Yong and Teng, Li Yuan and Yap, Seong Shan and Lau, Chun Sean and Chin, Yoong Tatt (2019) Thermomechanical studies of surface mounted microelectronics by finite element analysis. Composites Part B: Engineering, 162. pp. 461-468. ISSN 1359-8368
Book Section
Oon, Sim Jui and Tan, Khai Shiang and Tou, Teck Yong and Yap, Seong Shan and Lau, Chun Sean and Chin, Yoong Tatt (2018) Warpage Studies of Printed Circuit Boards with Shadow Moiré and Simulations. In: 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT). IEEE, pp. 1-5. ISBN 978-1-5386-6211-3
Conference or Workshop Item
Onn, Sim Jui and Tan, Khai Shiang and Tou, Teck Yong and Yap, Seong Shan and Lau, Chun Sean and Chin, Yoong Tatt (2019) Effect of Heating Profile of Printed Circuit Boards using Shadow Moiré and Simulations. In: 14th Asia Pacific Physics Conference (APPC 2019), 17-22 Nov. 2019, Borneo Convention Centre Kuching (BCCK), Kuching, Malaysia.
Tan, Khai Shiang and Onn, Sim Jui and Tau, Teck Yong and Lau, Chun Sean and Chin, Yoong Tatt (2019) Study on Lead-Free SAC305 Solder with different Particle Sizes generated with Laser Ablation Method. In: 14th Asia Pacific Physics Conference (APPC 2019), 17-22 Nov 2019, Borneo Convention Centre Kuching (BCCK), Kuching, Malaysia.
Thesis
Chin, Yoong Tatt (2014) Investigation of brittle fractures, interfacial kinetics and void formation in lead-free solders. PhD thesis, Multimedia University.