Design of Via-Hole for Dual Layer Butler Matrix


Md Jizat, Noorlindawaty and Yusoff, Zubaida and Yamada, Yoshihide and Zainudin, Norsiha (2019) Design of Via-Hole for Dual Layer Butler Matrix. In: The 2019 IEEE Asia-Pacific Conference on Applied Electromagnetics (APACE 2019), 25-27 Nov 2019, Hatten Hotel , Melaka, Malaysia.

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This paper presents a dual layer butler matrix for 5G wireless communication at 28 GHz using via-hole. Via-hole is proposed as the phase shifter connecting dual layer substrate Butler Matrix. In this design, two sides of the substrate are stacked to minimize the occupied area and to eliminate crossover component, resulting in a compact size and a low conductor loss. The two hybrids are designed at the top and bottom substrate with via-holes as the phase shifters and common ground plane at the centre. Phase shifters are designed using via-hole and Butler Matrix strip line is optimized for -45º, +135º, -135º and +45º output phase respectively. Consecutive phase input signal combiner/divider using the proposed Butler Matrix is executed at 28 GHz for fifth generation (5G) wireless connectivity. Index Terms—via-hole, dual layer, Butler Matrix, low loss, 5G

Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: Mobile communication
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK5101-6720 Telecommunication. Including telegraphy, telephone, radio, radar, television
Divisions: Faculty of Engineering (FOE)
Depositing User: Ms Rosnani Abd Wahab
Date Deposited: 15 Oct 2021 04:09
Last Modified: 15 Oct 2021 04:09


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