Citation
Chan, Sook Chien (2002) Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System. Masters thesis, Multimedia University. Full text not available from this repository.
Official URL: http://myto.perpun.net.my/metoalogin/logina.php
Abstract
The effect of gold -aluminum intermetallic growth at elevated temperatures on bond shear strength is studied. A diffusion model is derived from the Fick's first law for verifying with the measurement of gold-aluminum diffusion reaction rate.
| Item Type: | Thesis (Masters) |
|---|---|
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics |
| Divisions: | Faculty of Engineering (FOE) |
| Depositing User: | Ms Rosnani Abd Wahab |
| Date Deposited: | 13 Jul 2010 03:06 |
| Last Modified: | 13 Jul 2010 03:06 |
| URII: | http://shdl.mmu.edu.my/id/eprint/944 |
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