Citation

Wong, King J. and Low, Kean Ong and Israr, H. A. and Tamin, M. N. (2016) Thickness-dependent non-Fickian moisture absorption in epoxy molding compounds. Microelectronics Reliability, 65. pp. 160-166. ISSN 0026-2714

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Abstract

The objective of this research is to characterize the relationship between the moisture uptake behavior and the thickness in epoxy-based molding compounds (EMCs). Experimental results from the literature were adopted for this purpose. A thickness-dependent moisture uptake model was proposed to describe the moisture uptake behavior. In order to apply the model, a methodology to develop the fictitious Fickian curve was suggested. Subsequently, the relationships between the non-Fickian parameters and the thickness were correlated and compared. Results showed that the apparent diffusivity of the fictitious curve was sensitive to the environmental conditions but not the thickness. In addition, when combining all data, it was found that each normalized non-Fickian parameter could be described by a single equation with respect to the normalized thickness. Based on the thickness-dependent model, the moisture concentration across the thickness was further characterized. In conclusion, the model proposed in this study allows the prediction of moisture uptake behavior at various thicknesses of EMCs. This could greatly reduce the time and cost of extensive experimental works.

Item Type:	Article
Uncontrolled Keywords:	Thickness-dependent, Non-Fickian, Moisture, Absorption, Molding compound
Subjects:	Q Science > QD Chemistry > QD241-441 Organic chemistry
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Suzilawati Abu Samah
Date Deposited:	13 Dec 2017 16:52
Last Modified:	13 Dec 2017 16:52
URII:	http://shdl.mmu.edu.my/id/eprint/6638

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