Citation

Mhd Noor, Ervina Efzan and Singh, Amares (2014) Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys. Soldering & Surface Mount Technology, 26 (3). pp. 147-161. ISSN 0954-0911

Full text not available from this repository.

Abstract

The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (SAC) solder alloy. The SAC solder alloy has been proposed as the alternative solder to overcome the environmental concern of lead (Pb) solder. Many researchers have studied the SAC solder alloy and found that the properties such as melting temperature, wettability, microstructure and interfacial, together with mechanical properties, are better for the SAC solder than the tin – lead (SnPb) solders. Meanwhile, addition of various elements and nanoparticles seems to produce enhancement on the prior bulk solder alloy as well. These benefits suggest that the SAC solder alloy could be the next alternative solder for the electronic packaging industry. Although many studies have been conducted for this particular solder alloy, a compilation of all these properties regarding the SAC solder alloy is still not available for a review to say.

Item Type:	Article
Uncontrolled Keywords:	Pb-free, Solder joints, Solder, Sn-Ag-Cu, Interconnections
Subjects:	T Technology > T Technology (General)
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Nurul Iqtiani Ahmad
Date Deposited:	23 Oct 2014 06:38
Last Modified:	21 Feb 2017 10:17
URII:	http://shdl.mmu.edu.my/id/eprint/5792

Downloads

Edit (login required)