Citation

Lee, Foo Yeong (2011) Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding. Masters thesis, University of Multimedia.

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Abstract

In this work, a wire bonding path creation method using computer-aided design information is developed to support the wire bonding process. This method is named as Direct Integration Offline Programming (Di-OLP). The Di-OLP utilizes numerical coordinate data extracted from bonding diagram creation software instead of commercial CAD application to generate the bonding path component of the wire bonding program.

Item Type:	Thesis (Masters)
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Suzilawati Abu Samah
Date Deposited:	09 Apr 2012 04:14
Last Modified:	09 Apr 2012 04:14
URII:	http://shdl.mmu.edu.my/id/eprint/3470

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