Citation

Kanesalingam, Jeevan and Lee, See Fung and Ho, Hock Guan (2020) Study of Temperature Measurement Accuracy by Using Different Mounting Adhesives. Journal of Engineering Technology and Applied Physics, 2 (2). pp. 24-27. ISSN 26828383

Text 287 - Published Version Restricted to Repository staff only Download (2kB)

Abstract

Thermal compounds are adhesive used to improve heat conduction between two surfaces. It can be used to secure a thermocouple to a surface which the temperature is being measured. This paper studies the temperature accuracy when using different types of thermal adhesives to secure thermocouples to a metal surface. An aluminum block attached to heater resistors was heated up by supplying varying power levels to create different temperatures. The measured temperature is compared to a reference thermocouple in the aluminum block to check the accuracy of each thermocouple when it is secured with different adhesives. It was found using the Loctite 3873 to secure a thermocouple to a metal surface will produce the most accurate temperature reading with an error below 2.6oC. This enables researchers to use the appropriate adhesive to obtain the most accurate results and also to know what are the errors contributed by different adhesives.

Item Type:	Article
Uncontrolled Keywords:	Thermal compound, thermocouple adhesive, aluminum block, temperature
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics > TK7871 Electronics--Materials
Divisions:	Others
Depositing User:	Mr. MUHAMMAD AZRUL MOSRI
Date Deposited:	18 Jul 2024 02:26
Last Modified:	18 Jul 2024 02:26
URII:	http://shdl.mmu.edu.my/id/eprint/12655

Downloads

Edit (login required)