Citation

Tee Lau, Kok and Ern Kok, Hoi and Ab Maulod, Hairul Effendy and Abdul Latiff, Nurizzatul Zahirah and Abdul Aziz, Aida Nazifa and Rosli, Nur Hazirah (2019) Effect of Laminating Press’s Opening-Stacking Position on Adhesive Thickness in Coverlay/Adhesive/Flexible-Printed-Circuit Sheet. Journal of Engineering Technology and Applied Physics, 1 (1). pp. 1-3. ISSN 26828383

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Abstract

This study is to investigate the dependence of coverlay’s adhesive thickness on the laminating press’s opening-stacking position. Coverlays using acrylic- and epoxy-based adhesives were laminated onto similar size copper clad laminate (CCL) at 140 bars and 195°C for 150 min. Adhesive thickness measurements show opening-stacking positions near to the bottom of laminating press machine produced more consistent adhesive thickness as compared to the top positions.

Item Type:	Article
Uncontrolled Keywords:	Flexible electronics, adhesive layer, flexible printed circuit, Adhesive, copper clad laminate
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics > TK7871 Electronics--Materials
Divisions:	Others
Depositing User:	Mr. MUHAMMAD AZRUL MOSRI
Date Deposited:	15 Jul 2024 02:42
Last Modified:	15 Jul 2024 02:42
URII:	http://shdl.mmu.edu.my/id/eprint/12612

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