Citation

Mohamed Muzni, Nur Haslinda and Mhd Noor, Ervina Efzan and Abdullah, Mohd Mustafa Al Bakri (2022) Intermetallic compound growth mechanism of hybrid nanocomposite lead-free solder. In: 2nd FET PG Engineering Colloquium Proceedings 2022, 1-15 December 2022, Multimedia University, Malaysia. (Unpublished)

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Abstract

The lead-free SAC nanocomposite solder alloy was prepared by mechanically dispersing 0.25, 0.50, 0.75, and 1.0 wt% of TiO2 and Al2O3 nanoparticles into the lead-free SAC solder alloy. The samples were characterized for electrical conductivity, thermal analysis, wettability analysis, microstructural analysis, kinetic reaction analysis, and phase structure analysis.

Item Type:	Conference or Workshop Item (Other)
Uncontrolled Keywords:	Intermetallic compound, Nanoparticle, Lead-free, Nanocomposite
Subjects:	T Technology > TA Engineering (General). Civil engineering (General) > TA401-492 Materials of engineering and construction. Mechanics of materials
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Nurul Iqtiani Ahmad
Date Deposited:	20 Feb 2023 08:18
Last Modified:	20 Feb 2023 08:18
URII:	http://shdl.mmu.edu.my/id/eprint/10732

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