Items where Author is "Chun, Sean Lau"
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Conference or Workshop Item
Khai, Shiang Tan and Sim, Jui Onn and Chun, Sean Lau and Yoong, Tatt Chin and Chen, Hon Nee and Teck, Yong Tou and Seong, Shan Yap (2019) Study of the effects of carbon-based particle additives in SAC305 solders. In: The 27th Annual International Conference of Composite/Nanoengineering (ICCE27), 14-20 July 2019, University of Granada, Granada, Spain.