Study Of The Interaction Between The Functions Of Grit Size And Residual Damage Of An Ultra Thin Wafer

Cheong, Yew Wee (2002) Study Of The Interaction Between The Functions Of Grit Size And Residual Damage Of An Ultra Thin Wafer. Masters thesis, Multimedia University.

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Abstract

Wafer thinning operation's parameters such as grit size, spindle speed, feed rate, tape material and the wafer handling mechanism are becoming very critical as the wafer becomes thinner. Temperature also plays a role in determining the amount of residual stresses on the wafers post thinning. The findings from this research will be very valuable for future assembly process development.

Item Type: Thesis (Masters)
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
Divisions: Faculty of Engineering (FOE)
Depositing User: Ms Rosnani Abd Wahab
Date Deposited: 15 Jul 2010 06:34
Last Modified: 15 Jul 2010 06:34
URI: http://shdl.mmu.edu.my/id/eprint/968

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