Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement

Chin, Yoong Tatt (2002) Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement. Masters thesis, Multimedia University.

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Abstract

This project is to study the physical and thermo-mechanical of various underfills materials and its integration to the flip chip package. The objective of the project was accomplish by identifying key influencing factors in the underfill materials to meet 260 celsius high temperature reflow condition.

Item Type: Thesis (Masters)
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
Divisions: Faculty of Engineering (FOE)
Depositing User: Ms Rosnani Abd Wahab
Date Deposited: 15 Jul 2010 06:43
Last Modified: 15 Jul 2010 06:43
URI: http://shdl.mmu.edu.my/id/eprint/965

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