Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging


Yong, Su Kiat (2002) Oxidation Of Lead - Tin Solder Bumps In C4 Electronics Packaging. Masters thesis, Multimedia University.

Full text not available from this repository.


The flip chip-on-board technology of using Sn-Pb solder bump is becoming more common in the electronic packaging industry owing to cost saving in cladded printed circuit. But problem that plague the electronics packaging industry, like the non-wet solder joints, extrusion, etc, need to be studied. Effects of environmental exposure of dies left in the tape and storage for prolonged period on the chemical stability and packaging have yet been studied.

Item Type: Thesis (Masters)
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
Divisions: Faculty of Engineering (FOE)
Depositing User: Ms Rosnani Abd Wahab
Date Deposited: 14 Jul 2010 02:30
Last Modified: 14 Jul 2010 02:30
URII: http://shdl.mmu.edu.my/id/eprint/960


Downloads per month over past year

View ItemEdit (login required)