Thermomechanical studies of surface mounted microelectronics by finite element analysis


Tan, Khai Shiang and Onn, Sim Jui and Tou, Teck Yong and Teng, Li Yuan and Yap, Seong Shan and Lau, Chun Sean and Chin, Yoong Tatt (2019) Thermomechanical studies of surface mounted microelectronics by finite element analysis. Composites Part B: Engineering, 162. pp. 461-468. ISSN 1359-8368

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Surface mounted microelectronic (SMT) consist of components and packages mounted on printed circuit board (PCB) via solder joints. The SMT assemblies are subjected to elevated temperature during processing as well as during usage cycles. The processes result in thermal-mechanical strain to the SMT package which can reduce the lifespan of the product. In this work, the thermomechanical behaviour of a surface mounted microelectronic package-a solid state drive (SSD) is studied by finite element analysis (FEA). The results show that bared PCB warped when it is heated while PCB with packages resists the warpage thus generating stress at the solder joints. The results show that the stress level at the top of the solder joint (between the package and solder ball) is higher than the stress generated at the bottom of the solder joint (between the solder ball and PCB). FEA simulation also shows when a package is reduced in size by 50%, the thermomechanical induced stress at the solder joints decreased to a value well below the stress limit of the solder joint materials.

Item Type: Article
Uncontrolled Keywords: Thermomechanical
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions: Faculty of Engineering (FOE)
Depositing User: Ms Suzilawati Abu Samah
Date Deposited: 03 Nov 2021 03:00
Last Modified: 03 Nov 2021 03:00


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