Citation

Kok, Chee Kuang and Mhd Noor, Ervina Efzan and Ooi, Chin Chin and Loon, Kuan Teng (2018) Micromechanics Models of Industrial Printed Circuit Boards for Bending Analysis. Advanced Science Letters, 24 (11). 8826-8830(5). ISSN 1936-6612, 1936-7317

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Abstract

Industrial printed circuit boards (PCB)s are composites with complex geometrical features. In this study, a homogenization scheme was proposed to model bending, i.e., the primary deformation mode of industrial PCBs. Four-point bend tests were conducted on two types of industrial PCBs to measure their bending stiffness in the longitudinal and the lateral directions, respectively. The experimental results showed significant anisotropy and non-uniformity in the mechanical properties of the PCBs. PCB modelling was performed using the finite element method and a zoning approach. Three micromechanics models, namely Cox-Krenchel model, modified Cox Lamina model and Pan model, were adopted. These models were compared to the classical rule of mixtures (ROM). Results showed that ROM and the micromechanics models gave the upper and the lower bounds, respectively, of the stiffness and overall response of the PCB in bending. Among the micromechanics model, Pan model gave the best prediction of elastic stiffness, at accuracy of more than 80%.

Item Type:	Article
Uncontrolled Keywords:	Micromechanics
Subjects:	Q Science > QC Physics > QC170-197 Atomic physics. Constitution and properties of matter Including molecular physics, relativity, quantum theory, and solid state physics
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Suzilawati Abu Samah
Date Deposited:	29 Mar 2021 20:00
Last Modified:	29 Mar 2021 20:00
URII:	http://shdl.mmu.edu.my/id/eprint/7567

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