Citation

Amares, S. and Mhd Noor, Ervina Efzan and Durairaj, Rajkumar and Niakan, Aliasghar (2017) Influence of Nano-3%Al2O3 on the Properties of Low Temperature Sn-58Bi (SB) Lead-free Solder Alloy. IOP Conference Series: Materials Science and Engineering, 205. 012002. ISSN 1757-8981

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Abstract

This work studies the melting temperature, wettability, metallurgical and hardness properties of the Sn-58Bi (SB) lead-free solder alloy incorporated with nano-3%Al2O3. The melting temperature was observed at 143.44°C upon the additions of the nano-3%Al2O3 with a low contact angle of 20.4°. A well-distributed microstructure with narrower lamellar structure and finer intermetallic compounds and Sn grains was detected for the nano-3%Al2O3 added SB solder alloy. Hardness evaluation based on the Vickers hardness value was as high as 17.1Hv. Overall, the Sn-58Bi + 3% Al2O3 solder alloy appears to harvest beneficial results for these properties and can be used as potential replacement in the current electronic packaging industry.

Item Type:	Article
Uncontrolled Keywords:	Solder and soldering
Subjects:	T Technology > TS Manufactures > TS200-770 Metal manufactures. Metalworking
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Rosnani Abd Wahab
Date Deposited:	26 Oct 2020 21:28
Last Modified:	26 Oct 2020 21:28
URII:	http://shdl.mmu.edu.my/id/eprint/7088

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