Underfill flow void solutions through process and materials interaction

Ruthramurthy, Balachandran (2014) Underfill flow void solutions through process and materials interaction. IEEE Transactions on Components, Packaging and Manufacturing Technology, 4 (12). pp. 1999-2003. ISSN 2156-3950

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Abstract

Silicon dies were thinned down and bump pitch became smaller to have a lot of input/output in electronic device packages especially in package on package configuration. This presents challenges on underfill (UF) dispense processing. UF voids occurred near the dispense side of bumps in multiple dispense pass technology. In this paper, we will review UF flow behavior on thin die technology, as well as the process and material interaction that cause UF void formation. Process optimization, such as the time between two dispense passes has become a critical parameter to eliminate UF voids without causing UF epoxy roll up that can cause reliability failure.

Item Type: Article
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Divisions: Faculty of Engineering (FOE)
Depositing User: Ms Nurul Iqtiani Ahmad
Date Deposited: 13 Jan 2015 09:54
Last Modified: 13 Jan 2015 09:54
URI: http://shdl.mmu.edu.my/id/eprint/5928

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