A review: Influence of nano particles reinforced on solder alloy

Mhd Noor, Ervina Efzan and Singh, Amares and Yap, Tze Chuan (2013) A review: Influence of nano particles reinforced on solder alloy. Soldering & Surface Mount Technology, 25 (4). pp. 229-241. ISSN 0954-0911

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Abstract

Purpose – Recently nanoparticles reinforced lead free solders are vastly developed in electronics packaging industry. Studies and investigations have been conducted to learn and investigate the types, properties, method, availability and importance of nanoparticles in this field. Design/methodology/approach – Mechanical properties, melting temperature and microstructural conditions are taken into major considerations in any of the preparation on nanoparticles and being reviewed in this paper. Segregation of the types of nanoparticles being added together with their properties is summarized in this paper. High temperature reliability is crucial in providing a good viable solder and hence addition of nanoparticles have been seen to give a positive outcome in this particular property.

Item Type: Article
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Divisions: Faculty of Engineering and Technology (FET)
Depositing User: Ms Nurul Iqtiani Ahmad
Date Deposited: 08 May 2014 03:51
Last Modified: 08 May 2014 03:51
URI: http://shdl.mmu.edu.my/id/eprint/5489

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