Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding

Lee, Foo Yeong (2011) Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding. Masters thesis, University of Multimedia.

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Abstract

In this work, a wire bonding path creation method using computer-aided design information is developed to support the wire bonding process. This method is named as Direct Integration Offline Programming (Di-OLP). The Di-OLP utilizes numerical coordinate data extracted from bonding diagram creation software instead of commercial CAD application to generate the bonding path component of the wire bonding program.

Item Type: Thesis (Masters)
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
Divisions: Faculty of Engineering and Technology (FET)
Depositing User: Ms Suzilawati Abu Samah
Date Deposited: 09 Apr 2012 04:14
Last Modified: 09 Apr 2012 04:14
URI: http://shdl.mmu.edu.my/id/eprint/3470

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