Detection of bond cratering defects under aluminum wedge bond using I-V characteristics and liquid crystal thermography

Lau, C. K. and Sim, K. S. and Tso, C. P. and Ting, H. Y. (2009) Detection of bond cratering defects under aluminum wedge bond using I-V characteristics and liquid crystal thermography. In: Conference on Innovative Technologies in Intelligent Systems and Industrial Applications , JUL 25-26, 2009, Kuala Lumpur, MALAYSIA.

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Official URL: http://dx.doi.org/10.1109/CITISIA.2009.5224221

Abstract

This paper focuses on a failure analysis method on one common power IC failure encountered in the production lines. The new methodology utilizing liquid crystal thermography successfully shortens the total cycle time needed to detect the bond cratering defect and its root cause analysis. The decapsulated defective parts are subjected to suitable biasing current in liquid crystal thermography analysis to detect any hot spot emerging from the sides of the bonded aluminum wedge. This new method proves to be more effective and lower cost than the traditional decapsulation and delayering method.

Item Type: Conference or Workshop Item (Paper)
Subjects: T Technology > T Technology (General)
Q Science > QA Mathematics > QA75.5-76.95 Electronic computers. Computer science
Divisions: Faculty of Engineering and Technology (FET)
Depositing User: Ms Suzilawati Abu Samah
Date Deposited: 23 Sep 2011 08:27
Last Modified: 23 Sep 2011 08:27
URI: http://shdl.mmu.edu.my/id/eprint/1908

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