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Items where Author is "Ooi, Chin Chin"

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Kok, Chee Kuang and Mhd Noor, Ervina Efzan and Ooi, Chin Chin and Loon, Kuan Teng (2018) Micromechanics Models of Industrial Printed Circuit Boards for Bending Analysis. Advanced Science Letters, 24 (11). 8826-8830(5). ISSN 1936-6612, 1936-7317

Kok, Chee Kuang and Ng, Wen Jie and Ooi, Chin Chin and Liew, Kia Wai (2016) Ball-grid-array solder joint model for assembly-level impact reliability prediction. Microelectronics Reliability, 65. pp. 184-191. ISSN 0026-2714

Kok, Chee Kuang and Loon, Kuan Teng and Mohd. Noor, Ervina Efzan and Ooi, Chin Chin (2018) Modeling the Elastic Behavior of an Industrial Printed Circuit Board Under Bending and Shear. In: IEEE Transactions on Components, Packaging and Manufacturing Technology, 21 November 2018, Ministry of Higher Education.

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